KB-6167F，高TG無鉛環(huán)氧覆銅板采用優(yōu)質(zhì)玻璃纖維布及環(huán)氧樹脂經(jīng)特別工藝壓制而成，擁有較高的TG值,TG170可使它在更加高的溫度中工作．

特性：

●?Tg 170(DSC 測試),低Z軸 CTE值  Tg 170℃ (DSC Testing),low Z-axis expansion

●?相容紫外光阻擋及光學自動檢查功能,可提高PCB生產(chǎn)效率與準確性 UV Blocking and AOI (automatic optical inspection) compatible， so as to increase
productivity and accuracy

● 熱裂解溫度高 High Thermal Delamination
● 優(yōu)良的耐熱性,能滿足無鉛制程要求 Excellent heat resistance and appropriate for lead-free assembly

●?符合IPC-4101B的規(guī)范要求?IPC-4101B?specification?is?applicable

應用領(lǐng)域：

●計算機及外圍設備  Computer and peripheral

●通訊設備 Communication equipment

●儀器儀表 instrument

●辦公自動設備 OA equipment,etc

                    板材能性表